Potting / encapsulation

Illustrated explanation

Compound sealing needs a controlled boundary and cure

1Potting / encapsulation
Compound sealing needs a controlled boundary and cureCallout 1: Potting / encapsulation. Callout 2: Conductor barrier. Filling a component cavity and sealing separated conductors in a barrier gland are different assemblies. Voids, adhesion and cure affect the resulting boundary. Current term: Potting / encapsulation, callout 1. 1Interfaces and voidsPotting / encapsulation 2Separated conductorsConductor barrier
  1. Potting / encapsulationThis term

    Compound surrounds an assembly or fills a cavity according to the technique. A filled appearance does not prove absence of voids or a hermetic seal.

  2. Barrier gland

    The specified compound forms a barrier around individual conductors. Check conductor separation, preparation, curing and the complete certificate conditions.

Filling a component cavity and sealing separated conductors in a barrier gland are different assemblies. Voids, adhesion and cure affect the resulting boundary.

Conceptual compound sections, not an Ex preparation sequence. Barrier-gland cable preparation, compound identity, cure and certification conditions must follow the actual instructions.

ReferencesIEC 61984:2008 — Connectors — Safety requirements and testsIEC 60079-14 — Electrical installations design, selection and installationIEC 60079-1 — Equipment protection by flameproof enclosures “d”